Working area

• X: 305 mm; Y: 410 mm

• Z stroke: 32 mm

• P rotation: 440°

Mechatronic bondhead

• Wedge-wedge bondhead 45°, 60°

• Wedge-wedge bondhead 90° (deep access) for ribbon or wire

• Ball-wedge bondhead

Wire

• Al, Au, Ag, Cu, Pt: 12.5 µm – 75 µm*(0.5 mil – 3 mil)*

Ribbon

• Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm*
  (1.4 mil x 0.25 mil up to 10 mil x 1 mil)*

Fine wire loop design

• Loop generator for individualized loops

• Loop form functions: constant wire length, constant loop height, individual loop shapes

• Fine pitch (wedge-wedge): 40 µm inline, 25 µm staggered/dual line (depending on wire diameter and loop)

Footprint and weight

• 740 mm x 1484 mm x 1912 mm (W x D x H , excl. light tower)

• Weight: approx. 1150 kg

* depending on bondhead, application, wire